Zhen Ding Technology has filed a patent for a method of manufacturing a multilayer circuit board. The method involves attaching a support plate to an inner circuit substrate, placing an electronic module in a through hole, and pressing substrates onto the inner circuit substrate to encapsulate the electronic module. The patent also discloses a multilayer circuit board. GlobalData’s report on Zhen Ding Technology gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Zhen Ding Technology, Under-screen biometric identification was a key innovation area identified from patents. Zhen Ding Technology's grant share as of September 2023 was 50%. Grant share is based on the ratio of number of grants to total number of patents.
The patent is filed for a method of manufacturing a multilayer circuit board
A recently filed patent (Publication Number: US20230292446A1) describes a method for manufacturing a multilayer circuit board. The method involves several steps, including providing an inner circuit substrate with a through hole, attaching a support plate to seal the opening of the through hole, and providing an electronic module with a main body, electronic components, and adhesive layers. The electronic module is placed in the through hole and bonded to the support plate. Two substrates are then pressed onto the first and second surfaces of the inner circuit substrate, encapsulating the electronic module. Conductive wiring layers are formed on the surfaces of the substrates to obtain a first and second circuit substrate.
The patent also includes additional claims, such as forming a third and fourth circuit substrate on the surfaces of the conductive wiring layers, and forming conductive structures to connect the different wiring layers. The method also involves forming blind holes to expose portions of the electronic components and creating conductive structures to connect the components to the wiring layers.
The patent further describes a multilayer circuit board that includes the inner circuit substrate with the through hole, the electronic module encapsulated within the through hole, and the first and second circuit substrates covering the first and second surfaces of the inner circuit substrate. The multilayer circuit board may also include additional circuit substrates and conductive structures to connect the different wiring layers.
Overall, this patent presents a method for manufacturing a multilayer circuit board that involves encapsulating an electronic module within a through hole and forming conductive wiring layers on the surfaces of the substrates. The resulting circuit board can be used in various electronic devices and applications.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
