Wingtech Technology has been granted a patent for a lead frame assembly for semiconductor devices. The assembly includes a die attach structure and a clip frame structure with a continuous lead portion that does not divide into finger-like lead members. The design allows the lead portion to reach the top surface of a carrier efficiently. GlobalData’s report on Wingtech Technology gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Wingtech Technology, was a key innovation area identified from patents. Wingtech Technology's grant share as of April 2024 was 40%. Grant share is based on the ratio of number of grants to total number of patents.
Lead frame assembly for semiconductor device with continuous lead portion
The granted patent (Publication Number: US11973009B2) discloses a lead frame assembly for a semiconductor device, comprising a die attach structure and a clip frame structure. The clip frame structure includes a die connection portion and a merged lead portion with a continuous width along the die connection portion, eliminating the need for multiple finger-like lead members. This design allows the merged lead portion to reach the top surface of a carrier efficiently. The merged lead portion is strategically designed to maximize operating current and minimize spreading resistance, enhancing the overall performance of the clip frame structure.
Furthermore, the patent also covers a method of manufacturing a semiconductor device using the lead frame assembly. The method involves mounting a semiconductor die on the die attach structure and utilizing the clip frame structure with the merged lead portion. This merged lead portion, integrated with the die connection portion, is designed to project through a mold compound to reach the top surface of an external carrier. By extending across the width of the die connection portion and incorporating bends for flexibility, the merged lead portion optimizes operating current and reduces spreading resistance. Overall, the patented lead frame assembly and manufacturing method aim to improve the efficiency and performance of semiconductor devices through innovative design and construction techniques.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
