According to GlobalData’s company profile on TTM Technologies, Under-screen biometric identification was a key innovation area identified from patents. TTM Technologies's grant share as of May 2024 was 65%. Grant share is based on the ratio of number of grants to total number of patents.

Method for forming stub-less plated through-holes in pcbs

A recently granted patent (Publication Number: US11997800B2) discloses a method for modifying a via of a PCB to create a stub-less through-hole. The method involves drilling the via of the PCB to form a through-hole, depositing a seed material for plating a conductive material, back drilling a portion of the through-hole to create a blind via, and selectively plating the conductive material to form a stub-less plated through-hole. The drill used in the process features an inner core made of conductive material, an outer coating layer with non-conductive material, and a coating near the bottom of the inner core.

Furthermore, the method includes additional steps such as back drilling a second portion of the PCB to form a second blind via, with the plated conductive material not adhering to these blind vias. The seed material used for plating is electroless copper and is conductive in nature. The innovative method aims to improve the efficiency and reliability of PCB manufacturing processes, particularly in creating stub-less through-holes for enhanced performance and durability in electronic devices.

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