Toshiba grant share with connectivity as a theme is 7% in Q1 2024. Grant share is based on the ratio of number of grants to total number of patents.

Recent Patents

Application: Electronic package and method of manufacturing an electronic package (Patent ID: US20240053552A1)

The patent filed by Toshiba Corp describes an electronic package consisting of an active element, a first substrate with conductive tracks, and a second substrate with conductive tracks. The active element is placed on the first substrate, with the second substrate positioned over it, allowing access to the active element. The active element is electrically connected to the conductive tracks on both substrates. The package may include a photonic element, a gap for radiation emission, and a photonic integrated circuit.

The claims detail various aspects of the electronic package, such as the materials used for the substrates, the tiered arrangement of substrates, the number of conductive tracks, and the configuration for radiation emission. Additionally, the claims cover the use of bond wires for electrical connections, the inclusion of a PCBA or heatsink, and the absence of contacts on the opposite side of the first substrate. The method of fabricating the electronic package involves providing the substrates, placing the active element, positioning the second substrate, and electrically connecting the active element to the conductive tracks. Overall, the patent focuses on a specific design and construction of an electronic package with detailed features and methods for fabrication.

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