Texas Instruments. has been granted a patent for a semiconductor package featuring a semiconductor die with a circuit on its device side. The package includes conductive members and wirebonded members, with at least one wirebonded member having a gauge of at least 5 mils, enhancing its electrical connectivity. GlobalData’s report on Texas Instruments gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Texas Instruments, Under-screen biometric identification was a key innovation area identified from patents. Texas Instruments's grant share as of June 2024 was 70%. Grant share is based on the ratio of number of grants to total number of patents.
Semiconductor package with wirebonded members and conductive members
The patent US12046542B2 describes a semiconductor package that integrates a semiconductor die with a circuit on its device side and a non-device side. The package features a first conductive member attached to the non-device side of the die, with its second surface exposed on the package's top surface. A lead is electrically connected to the device side, while multiple wirebonded members are affixed to the second surface of the conductive member, extending from the package's top. Notably, at least one of these wirebonded members has a gauge of at least 5 mils, and various bonding techniques, including wedge-bonding and ribbon-bonding, are employed. The lead is specified as a gullwing-style lead, and the conductive member and wirebonded members may be composed of metal, with copper being a preferred material.
Additionally, the patent outlines an alternative semiconductor package design where the semiconductor die's non-device side faces the top surface of the package. In this configuration, a conductive member is electrically linked to the device side, and wirebonded members are vertically aligned with the die, projecting from the top surface. These wirebonded members have opposing ends bonded to the package's surface, with a raised segment in between. The design allows for various bonding methods, including wedge-bonding, ribbon-bonding, and ball-bonding. The package may also include a die pad exposed on the top surface, to which the wirebonded members are connected, and a mold compound layer that covers the die while defining a cavity for the wirebonded members.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
