Texas Instruments has filed a patent for an apparatus that includes primary and secondary coils. The primary coils have multiple portions, while the secondary coil is divided into two portions in one wafer layer, connected by a bridge in another wafer layer. The primary coil portions are nested inside the secondary coil portions. GlobalData’s report on Texas Instruments gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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An apparatus with nested primary and secondary coils
A recently filed patent (Publication Number: US20230317348A1) describes an apparatus for a distributed active transformer (DAT) that includes primary and secondary coils. The primary coils are divided into three portions and are located in a first wafer layer. The secondary coil is also divided into two portions and is situated in the same wafer layer. The second portion of each primary coil is nested inside the corresponding portion of the secondary coil. Additionally, the first and third portions of the primary coils are adjacent to the second portion of the secondary coil.
The apparatus further includes a bridge in a second wafer layer that connects the first and second portions of the secondary coil. The first and third portions of the primary coils are nested outside the second portion of the secondary coil. The primary coils are coupled together by joiners, either in the first wafer layer or in a third wafer layer. The second wafer layer is positioned above the first wafer layer, while the third wafer layer is located below it.
The apparatus also features leads that are coupled to the first and second portions of the secondary coil, providing a differential output signal. These leads are situated in the second wafer layer. The first and third portions of the primary coils are configured to receive differential input signals.
In addition to the apparatus, the patent also describes a distributed active transformer (DAT) that includes primary and secondary coils. The primary coils are divided into three portions and are located in a third wafer layer, while the secondary coil is situated in a first wafer layer. The second portion of each primary coil is nested inside the corresponding portion of the secondary coil. The third wafer layer is adjacent to the first wafer layer.
The DAT includes vias that connect the portions of the primary coils in the third wafer layer to the corresponding portions in the first wafer layer. The second wafer layer is positioned above the first wafer layer, and the third wafer layer is located below it. The DAT also includes leads in the second wafer layer that are coupled to the portions of the secondary coil, providing a differential output signal.
Lastly, the patent describes a system that includes primary and secondary coils. The primary coils are divided into three portions and are located in a first wafer layer, while the secondary coil is situated in the same wafer layer. The second portion of each primary coil is nested inside the corresponding portion of the secondary coil. The first and third portions of the primary coils are adjacent to the second portion of the secondary coil.
The system also includes a bridge in a second wafer layer that connects the first and second portions of the secondary coil. The primary coils are coupled together by joiners, either in the first wafer layer or in a third wafer layer. The second wafer layer is positioned above the first wafer layer, while the third wafer layer is located below it.
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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.
GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
