TDK had two patents in connectivity during Q2 2024. The patent filed by TDK Corp in Q2 2024 relates to a heat-assisted magnetic recording (HAMR) write head incorporating an iridium (Ir) film with a plasmon generator (PG) film. The Ir film includes a body layer and a thin Ir seed layer in direct contact with a dielectric, providing high efficiency and reliability during the writing process. GlobalData’s report on TDK gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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TDK had no grants in connectivity as a theme in Q2 2024.
Recent Patents
Application: Iridium film with a thin iridium template layer for a heat-assisted magnetic recording (HAMR) writer (Patent ID: US20240112693A1)
The present embodiments describe a heat-assisted magnetic recording (HAMR) write head incorporating an iridium (Ir) film with a body layer and a plasmon generator (PG) film containing a thin Ir seed layer. The Ir film, with a thickness of 40 nanometers or less, is designed to be efficient in surface plasmon generation and reliable under high-temperature conditions during the writing process.
The HAMR write head includes a main pole, a PG portion with an Ir film, and a first dielectric spacer layer. The method for manufacturing the write head involves disposing a seed layer and body layer over a bottom planar generator (BSH) layer, adding dielectric spacers, a heat sink, and a non-magnetic spacer layer, and finally placing the main pole portion. The body layer and seed layer are patterned to a target dimension of 40 nanometers or less, with the seed layer thickness ranging from 10 A to 30 A. Additionally, a resist mask is applied during the process to etch portions of the dielectric spacers.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
