Taiwan Semiconductor Manufacturing had five patents in digitalization during Q4 2023. The patents filed by Taiwan Semiconductor Manufacturing Co Ltd in Q4 2023 include an apparatus and method for detecting and adjusting a polishing pad profile during a polish process, as well as a memory device with a memory array where memory cells are connected to word lines and bit lines, with adjacent memory cells sharing portions of the bit line. GlobalData’s report on Taiwan Semiconductor Manufacturing gives a 360-degreee view of the company including its patenting strategy. Buy the report here.
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Taiwan Semiconductor Manufacturing grant share with digitalization as a theme is 40% in Q4 2023. Grant share is based on the ratio of number of grants to total number of patents.
Recent Patents
Application: Chemical mechanical polishing apparatus and method (Patent ID: US20230381918A1)
The patent filed by Taiwan Semiconductor Manufacturing Co Ltd describes an apparatus and method for detecting and adjusting the polishing process based on the profile of the polishing pad. The apparatus includes a detection module with a probe to measure thickness and a beam to support the probe, allowing it to move along the beam. The method involves determining the profile of the polishing pad, comparing it to a reference profile, and adjusting parameters like rotation speed, pressure, and slurry supply based on the comparison. The system can also scan the surface of the polishing pad using optical or acoustic devices to determine the surface profile and adjust the location of the wafer being polished accordingly.
Furthermore, the method includes measuring the surface profile of the polishing pad while polishing the wafer, determining the condition of the polishing pad's surface, and adjusting parameters like rotation speed or pressure based on this condition. The adjustment process can also involve dispensing slurry on the polishing pad or conditioning the pad by adjusting the rotation speed or pressure of the conditioner. Overall, the patent aims to optimize the polishing process by continuously monitoring and adjusting various parameters based on the detected profile of the polishing pad, ensuring efficient and effective substrate polishing.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
