Sunny Optical Technology (Group) has patented a circuit board design with a flexible circuit board layer, rigid circuit board layer, chip connection portion, and bending portion. The innovative design allows for easy inversion of the bending portion to align flexible circuit board layers. GlobalData’s report on Sunny Optical Technology (Group) gives a 360-degree view of the company including its patenting strategy. Buy the report here.

According to GlobalData’s company profile on Sunny Optical Technology (Group), Under-screen biometric identification was a key innovation area identified from patents. Sunny Optical Technology (Group)'s grant share as of January 2024 was 41%. Grant share is based on the ratio of number of grants to total number of patents.

Flexible-rigid circuit board with invertible bending portion

Source: United States Patent and Trademark Office (USPTO). Credit: Sunny Optical Technology (Group) Co Ltd

A recently granted patent (Publication Number: US11885955B2) discloses a unique circuit board design comprising a combination of rigid and flexible circuit board layers. The circuit board includes a chip connection portion and a bending portion, allowing for invertible connection between the two sections. The design enables the bending portion to be flipped to the rear side of the chip connection portion without protruding from the rigid circuit board layer, providing a compact and efficient layout. Additionally, the circuit board may include a reinforcing member on the bending portion to secure the flexible circuit board layer in place.

Furthermore, the patent extends to a circuit board jointed panel and a periscope camera module incorporating the innovative circuit board design. The periscope camera module features a lenses assembly and a photosensitive assembly connected through the circuit board. The circuit board in the periscope camera module includes a rigid circuit board layer, a flexible circuit board layer, a chip connection portion, and a bending portion, facilitating the connection between the photosensitive chip and other components. The invertible connection between the bending portion and the chip connection portion allows for efficient assembly and compact integration within the camera module, showcasing the versatility and practical applications of the patented circuit board design.

To know more about GlobalData’s detailed insights on Sunny Optical Technology (Group), buy the report here.

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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.