Sunny Optical Technology has filed a patent for a camera module that includes a circuit board, photosensitive element, optical lens, and filter element. The photosensitive element is conductively connected to the substrate of the circuit board, and the filter element is directly mounted on the substrate front surface. The module aims to improve camera performance and image quality. GlobalData’s report on Sunny Optical Technology (Group) gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Sunny Optical Technology (Group), under-screen biometric identification was a key innovation area identified from patents. Sunny Optical Technology (Group)'s grant share as of September 2023 was 41%. Grant share is based on the ratio of number of grants to total number of patents.
Camera module with circuit board, photosensitive element, lens, and filter
A recently filed patent (Publication Number: US20230317747A1) describes a camera module with several innovative features. The camera module includes a circuit board with at least one substrate, which has a front surface, a back surface, and a channel. The photosensitive element, which has a photosensitive area and a non-photosensitive area, is mounted on the back surface of the substrate and conductively connected to it. The photosensitive area and a part of the non-photosensitive area correspond to the substrate channel. Additionally, the camera module includes an optical lens held in the photosensitive path of the photosensitive element and a filter element mounted directly on the front surface of the substrate.
One of the key features of this camera module is the formation of a sealed space by the substrate, photosensitive element, and filter element at the position corresponding to the substrate channel. This arrangement ensures that the photosensitive area and the remaining part of the non-photosensitive area are held within the sealed space.
The camera module also includes a buffer portion between the filter element and the front surface of the substrate. This buffer portion is designed to attach the filter element to the substrate. It can be in the shape of a frame and is elastic, providing flexibility and stability to the module.
Furthermore, the camera module incorporates molded bases with light windows that surround the photosensitive area of the photosensitive element. These molded bases are integrally bonded to the substrate, filter element, and photosensitive element. The buffer portion is held between the molded base and the front surface of the substrate.
The camera module may also include electronic components conductively connected to the substrate. These components can protrude from the front surface of the substrate, and the molded base embeds at least a part of the protruding electronic component. The buffer portion overlaps with the electronic component and the filter element in the optical axis direction.
In addition, the camera module may have multiple electronic components, some of which are conductively connected to the back surface of the substrate and protrude from it. The electronic components on the front and back surfaces overlap in the optical axis direction.
Other features of the camera module include frame-shaped support elements disposed on the outer edge of the filter element, a filler to fill the gap between the substrate back surface and the non-photosensitive area of the photosensitive element, and a filler that protrudes from the substrate toward the optical axis.
Overall, this patent describes a camera module with various innovative features that enhance its functionality and performance.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
