Screen has been granted a patent for a substrate processing method that involves forming a liquid film and a gas phase layer, followed by substrate rotation and opening expansion. This method enhances the efficiency of processing liquids on substrates with patterns, utilizing controlled heating and light irradiation. GlobalData’s report on Screen gives a 360-degree view of the company including its patenting strategy. Buy the report here.

According to GlobalData’s company profile on Screen, Semiconductor fabrication robots was a key innovation area identified from patents. Screen's grant share as of June 2024 was 52%. Grant share is based on the ratio of number of grants to total number of patents.

Substrate processing method using liquid and vapor layers

Source: United States Patent and Trademark Office (USPTO). Credit: Screen Holdings Co Ltd

The patent US12042813B2 outlines a substrate processing method designed to enhance the efficiency of liquid film formation and vapor layer management on a substrate's surface. The method involves several key steps, starting with the application of a processing liquid to the substrate, which is held horizontally. A vapor layer is then formed at the center of the substrate by radiating light to heat a specific region, creating a vapor layer that supports the liquid film. The substrate is rotated to shape the vapor layer into an annular form, while simultaneously expanding the vapor layer and a central hole through controlled heating and gas spraying techniques. This process allows for precise manipulation of the vapor layer's dimensions and properties.

Additionally, the patent describes a substrate processing apparatus that includes various components such as a substrate holding unit, a rotating unit, a processing liquid supply unit, and a lamp heater. The apparatus is designed to facilitate the steps outlined in the method, ensuring that the vapor layer is effectively managed during processing. The controller within the apparatus coordinates the operations of these components, allowing for the dynamic adjustment of heating and gas spraying regions. This innovative approach aims to improve the quality and uniformity of the substrate processing, making it particularly relevant for applications in semiconductor manufacturing and other precision industries.

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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.