Samsung Electro-Mechanics has been granted a patent for a multilayer electronic component. The component includes a multilayer capacitor with external electrodes and a connection terminal with land portions. The thickness of the capacitor is defined as T1 and the distance from the electrodes to the terminal is defined as T2, with T1/T2 being 0.6 to 0.9. The connection terminal also includes a bridge portion made of a non-conductive material and land portions made of a conductive material. GlobalData’s report on Samsung Electro-Mechanics gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Samsung Electro-Mechanics, Under-screen biometric identification was a key innovation area identified from patents. Samsung Electro-Mechanics's grant share as of September 2023 was 34%. Grant share is based on the ratio of number of grants to total number of patents.
The patent is granted for a multilayer electronic component
A recently granted patent (Publication Number: US11776753B2) describes a multilayer electronic component, specifically a multilayer capacitor, and its connection terminal. The multilayer capacitor includes a capacitor body with external electrodes spaced apart on its mounting surface. The connection terminal consists of land portions that are placed on the external electrodes. The patent claims that the ratio of the thickness of the multilayer capacitor (T1) to the distance from the uppermost end of the external electrodes to the bottom of one of the land portions (T2) should be between 0.6 and 0.9.
The connection terminal also includes a bridge portion made of a non-conductive material, which is positioned between the land portions. One land portion is placed on one surface of the bridge portion, while the other land portion is placed on the opposite surface. The bridge portion and the land portions are made of different materials to ensure their distinction. The patent further mentions the use of conductive adhesives between the land portions and the external electrodes.
The multilayer capacitor described in the patent has a specific structure. It consists of a capacitor body with multiple internal electrodes stacked alternately in different directions. The external electrodes include band portions on the mounting surface, which are spaced apart from each other. Connection portions extend from the band portions onto the opposing surfaces of the capacitor body and are connected to the internal electrodes. The land portions are placed on the band portions and have cutouts on their surfaces facing each other.
The patent also mentions the use of a board with the multilayer electronic component mounted on it. The board includes a substrate with electrode pads, and the land portions of the connection terminal are mounted on the electrode pads in a one-to-one manner.
Overall, this patent describes a specific design for a multilayer electronic component, particularly a multilayer capacitor, and its connection terminal. The design aims to optimize the thickness and distance ratio, as well as ensure proper connection between the component and a board. The use of different materials for the bridge portion and land portions, along with conductive adhesives, enhances the functionality and performance of the component.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
