Quanta Computer has filed a patent for a dust-proof telecommunication system. The system includes a chassis, critical components such as a CPU and memory module, and a filter module that surrounds and cools these components. The filter module has an air filter at the inlet of the airflow to prevent dust from entering the system. GlobalData’s report on Quanta Computer gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Quanta Computer, Data center cooling systems was a key innovation area identified from patents. Quanta Computer's grant share as of September 2023 was 73%. Grant share is based on the ratio of number of grants to total number of patents.
Dust-proof telecommunication system with filtered cooling for components
A recently filed patent (Publication Number: US20230309258A1) describes a dust-proof telecommunication system that aims to protect the internal components of the system from dust and other airborne particles. The system includes a chassis, a central processing unit (CPU) or system on chip (SoC) located within the chassis, and a filter module positioned near the CPU or SoC. The filter module has a filter cover that surrounds the CPU or SoC and a first air filter located at the inlet of the airflow.
In addition to the above, the telecommunication system also includes a cooling plate that extends between two side walls, creating a protective space for the computing components. A fin structure is formed on the cooling plate, extending away from the protective space. An opening is formed on the cooling plate to receive the filter module, and the top surface of the filter cover aligns with the top surface of the fin structure when the filter module is placed in the opening. The first air filter is located between the top surface and the bottom surface of the filter cover, and a second air filter is located at the outlet of the airflow.
The system further includes a memory module located within the chassis near the CPU or SoC, and an opening is formed on the cooling plate to provide access to the protective space. The filter module is placed in this opening and is replaceably fixed to the cooling plate using a tightening mechanism or removable screws. The filter module is designed to prevent airborne particles from entering the protective space, ensuring the internal components remain dust-free.
The patent also describes a telecommunications frame for mounting computing components, which includes an airflow cooling device, an airflow opening, a protective space, and a replaceable filter module with an air filter. The air filter is positioned near the airflow opening to prevent airborne particles from entering the protective space. The telecommunications frame may also include a fan array with multiple fans to generate cooling air that dissipates the heat generated in the protective space.
Lastly, the patent discusses a computing device comprising a Printed Circuit Board Assembly (PCBA) on which computing components are mounted, a CPU, a memory module, and a cooling plate. The cooling plate has a replaceable filter module with an air filter, allowing access to the CPU and memory module when the filter assembly is removed. The cooling air generated by a fan array and filtered by the air filter cools the CPU and memory module, dissipating the heat out of the computing device.
Overall, this patent presents innovative solutions for creating a dust-proof telecommunication system and computing devices that effectively protect internal components from dust and airborne particles.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
