OSI Systems. has been granted a patent for a method of attaching a detector to a substrate with electrically conducting pads. The process involves using non-conductive adhesive to create barriers around the pads, applying conductive adhesive, and positioning the detector to ensure contact with both adhesive types. GlobalData’s report on OSI Systems gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on OSI Systems, was a key innovation area identified from patents. OSI Systems's grant share as of June 2024 was 58%. Grant share is based on the ratio of number of grants to total number of patents.
Method for attaching a detector to a substrate
The patent US12043016B2 outlines a method for attaching a detector to a substrate featuring a first surface with multiple electrically conducting pads. The process begins with the application of a non-conductive adhesive material, which is strategically placed between the conducting pads to create walls that form an enclosure. This enclosure is designed to hold a specific volume of conductive adhesive material, which is then applied to each pad. The detector is positioned onto the substrate, ensuring contact with both the non-conductive and conductive adhesives. The method also includes a gravity-induced flow of the conductive adhesive towards the detector, which can last from five minutes to 48 hours, followed by thermal curing to solidify the adhesives.
Further details of the method specify that the non-conductive adhesive can be double-sided tape, while the conductive adhesive is typically silver epoxy glue. The volume of the enclosure is defined as 0.3 mm x 0.3 mm x 0.3 mm, with the conductive adhesive's amount varying between 0.3 mm x 0.3 mm x 0.15 mm and 0.3 mm x 0.3 mm x 0.3 mm. The non-conductive adhesive is characterized by a higher viscosity than the conductive adhesive and is intended to provide electrical isolation between the detector's pixels. The method also allows for the use of mechanical jigs to facilitate the positioning of the detector and substrate during the attachment process. Overall, this patent presents a detailed approach to effectively and reliably attach detectors to substrates in electronic applications.
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