Monolithic Power Systems has been granted a patent for a compact and cost-effective multi-die package structure. The design includes an embedded die in a substrate, a flip chip die mounted above, and an attached die on top. The structure allows for efficient electrical coupling and bonding. GlobalData’s report on Monolithic Power Systems gives a 360-degree view of the company including its patenting strategy. Buy the report here.
According to GlobalData’s company profile on Monolithic Power Systems, Power MOSFET SMPS was a key innovation area identified from patents. Monolithic Power Systems's grant share as of May 2024 was 76%. Grant share is based on the ratio of number of grants to total number of patents.
Multi-die package structure with embedded, mounted, and attached dies
A recently granted patent (Publication Number: US12002787B2) discloses a multi-die package structure for electronic devices. The structure includes a first die embedded in a substrate, a second die mounted above the substrate and electrically coupled to it, and a third die attached onto the second die. The third die is configured to contact the substrate using a bonding wire. The patent also details the arrangement of the dies and the conductors used for electrical coupling within the package.
Furthermore, the patent describes a multi-die co-packed chip design, where different dies are interconnected within a single package. The chip includes input, switch, ground, and control pins that are electrically coupled to various dies within the package. The method for co-packing the dies involves embedding a first die in the substrate, mounting a second die over the substrate, attaching a third die onto the second die, and electrically coupling the dies using conductors and bonding wires. The package is then molded to create a compact and integrated electronic component. The patent outlines specific configurations and arrangements for the dies and conductors to optimize the performance and functionality of the multi-die co-packed chip.
To know more about GlobalData’s detailed insights on Monolithic Power Systems, buy the report here.
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