Monolithic Power Systems has been granted a patent for a compact and cost-effective multi-die package structure. The design includes an embedded die in a substrate, a flip chip die mounted above, and an attached die on top. The structure allows for efficient electrical coupling and bonding. GlobalData’s report on Monolithic Power Systems gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Monolithic Power Systems, Power MOSFET SMPS was a key innovation area identified from patents. Monolithic Power Systems's grant share as of May 2024 was 76%. Grant share is based on the ratio of number of grants to total number of patents.
Multi-die package structure with embedded, mounted, and attached dies
A recently granted patent (Publication Number: US12002787B2) discloses a multi-die package structure for electronic devices. The structure includes a first die embedded in a substrate, a second die mounted above the substrate and electrically coupled to it, and a third die attached onto the second die. The third die is configured to contact the substrate using a bonding wire. The patent also details the arrangement of the dies and the conductors used for electrical coupling within the package.
Furthermore, the patent describes a multi-die co-packed chip design, where different dies are interconnected within a single package. The chip includes input, switch, ground, and control pins that are electrically coupled to various dies within the package. The method for co-packing the dies involves embedding a first die in the substrate, mounting a second die over the substrate, attaching a third die onto the second die, and electrically coupling the dies using conductors and bonding wires. The package is then molded to create a compact and integrated electronic component. The patent outlines specific configurations and arrangements for the dies and conductors to optimize the performance and functionality of the multi-die co-packed chip.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
