Micron Technology grant share with advanced materials as a theme is 75% in Q1 2024. Grant share is based on the ratio of number of grants to total number of patents.

Recent Patents

Application: Piezoelectric materials for on-die thermal enhancement of hybrid bonding and associated systems and methods (Patent ID: US20240071986A1)

The patent filed by Micron Technology Inc. describes a semiconductor die with a unique structure that includes a bond pad with a recessed top surface and a region of piezoelectric material in the dielectric layer. This piezoelectric material can supply thermal energy to the bond pad when exposed to an externally-applied field, allowing for controlled expansion of the bond pad's top surface towards the dielectric layer. The method outlined in the patent involves attaching two semiconductor dies with aligned bond pads and using the piezoelectric material to supply thermal energy, enabling the bond pads to bond directly to each other at a lower temperature than would be required without this technology.

Furthermore, the patent details various specific embodiments, such as the composition of the piezoelectric material, the spacing between the piezoelectric region and the bond pad, and the frequency and strength of the externally-applied electric field. These details aim to optimize the bonding process between semiconductor dies and ensure a reliable and efficient connection. Overall, the patent introduces a novel approach to semiconductor die bonding using piezoelectric materials to facilitate controlled thermal energy transfer, ultimately improving the performance and reliability of semiconductor device assemblies.

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