MACOM Technology Solutions has filed a patent for radio frequency (RF) power pallets that include primary and daughter circuit boards. The RF power pallets feature a first circuit board with a first metal layer and a second circuit board with a bias voltage driver for the RF power amplifier. The second circuit board extends the features of the RF pallet while minimizing increases in size, costs, and complexity. GlobalData’s report on MACOM Technology Solutions gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on MACOM Technology Solutions, Quantum dot devices was a key innovation area identified from patents. MACOM Technology Solutions's grant share as of September 2023 was 70%. Grant share is based on the ratio of number of grants to total number of patents.
Rf power pallet with improved circuit board configuration
A recently filed patent (Publication Number: US20230319995A1) describes a radio frequency (RF) power pallet that includes a first circuit board with two metal layers and a second circuit board positioned over the first circuit board. The RF power amplifier is electrically coupled to the first metal layer of the first circuit board. The second circuit board includes a bias voltage driver for the gate of the RF power amplifier. The first circuit board and the second circuit board have different core materials, and the first metal layer includes a bias voltage trace that extends from a contact of the second circuit board to the gate of the RF power amplifier.
The second circuit board in the RF power pallet may include castellated edge contacts, a power sequencing controller, a current sense feedback controller for the RF power amplifier, a temperature-compensated bias voltage driver, and a low voltage regulator for data control communications. The first metal layer of the first circuit board may also include a power control trace, a current sense feedback trace, a temperature sense feedback trace, and a local interface trace. The second circuit board may have multiple metal layers for electrical interconnection of discrete and integrated components.
In another embodiment of the RF power pallet, the first circuit board includes a via matrix positioned between rows of pads for interconnect with the second circuit board. The RF power amplifier in this embodiment may comprise gallium nitride materials.
Overall, this patent describes an RF power pallet with a unique design that includes multiple circuit boards with different core materials and various components for power control, sequencing, feedback, and communication. The use of different core materials and metal layers allows for efficient electrical interconnection and performance optimization. The RF power pallet can be used in various applications that require high-power RF amplification.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
