Lam Research had four patents in robotics during Q2 2024. Lam Research Corp’s patents in Q2 2024 focus on innovative transfer robot assemblies within ATV transfer modules, semiconductor-processing tools with diamond-shaped processing stations, and a method for cleaning substrate processing chamber surfaces using specific gases and plasma etching techniques. These inventions aim to improve efficiency and precision in semiconductor manufacturing processes. GlobalData’s report on Lam Research gives a 360-degree view of the company including its patenting strategy. Buy the report here.

Lam Research had no grants in robotics as a theme in Q2 2024.

Recent Patents

Application: Transfer robot for reduced footprint platform architecture (Patent ID: US20240194505A1)

The patent filed by Lam Research Corp. describes an ATV transfer module with a transfer robot assembly that can adjust the position of the transfer robot in both vertical and horizontal directions to transfer substrates between loading stations and load locks. The transfer robot can fold into a narrow profile to occupy less than 50% of the overall depth of the ATV transfer module, providing efficient use of space.

The claims detail the configuration of the ATV transfer module, including the use of lateral and vertical rails for the transfer robot assembly to move vertically and horizontally. The transfer robot assembly consists of two arms with arm segments and end effectors, allowing for precise substrate transfer. The arms can move independently to access different stations simultaneously, and the module can accommodate different percentages of load locks within its interior volume. Additionally, the patent covers the integration of the ATV transfer module into a substrate processing tool with a vacuum transfer module, providing a comprehensive solution for substrate handling in semiconductor manufacturing processes.

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