Kyocera has been granted a patent for a composite substrate that includes a wiring board with a protruding part and a metallic frame member. The protruding part has a raised center portion and external connection terminals, while the frame member has an opening that surrounds the protruding part. The composite substrate is designed for use in electric devices. GlobalData’s report on Kyocera gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Kyocera, Under-screen biometric identification was a key innovation area identified from patents. Kyocera's grant share as of September 2023 was 33%. Grant share is based on the ratio of number of grants to total number of patents.
A patent granted for a composite substrate with a protruding part and metallic frame
A recently granted patent (Publication Number: US11778747B2) describes a composite substrate with a unique wiring board design. The substrate includes a base material with a protruding part that rises from one side towards the outside. The protruding part has a specific shape where the center portion of the principal surface is elevated from the outer periphery. On the principal surface, a plurality of external connection terminals are arranged, and a metallic frame member surrounds the protruding part, filling its periphery.
In addition to the main claim, the patent also includes several dependent claims that provide further details and variations of the composite substrate design. These claims describe features such as convex or concave curvature of the side surface of the external connection terminals, a difference in thickness between the outer periphery and inner portion of the terminals, and a concavely curved connection between the base periphery portion and the side surface of the protruding part.
The patent also mentions that the base material may have concave or convex parts on the right face and that the surface of the metallic frame member is flush with the principal surface. The metallic frame member can include a groove or a wall part in the periphery of the opening that surrounds the protruding part.
Furthermore, the patent discusses the application of the composite substrate in electric devices. It states that an electric element can be placed on the right face of the composite substrate, which includes the wiring board described in the previous claims. The patent also introduces the concept of a second principal surface, opposite to the principal surface of the base material, which serves as the right face. This right face includes a plurality of element connection terminals, with smaller planar dimensions compared to the external connection terminals.
Overall, this granted patent presents a novel composite substrate design for wiring boards, offering various features and configurations that can be applied in electric devices. The unique shape of the protruding part, the arrangement of external connection terminals, and the inclusion of a metallic frame member contribute to the functionality and versatility of the substrate.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
