Kulicke & Soffa Industries. has been granted a patent for a bonding system that features a bond head assembly and a reducing gas conduit. This system enhances semiconductor bonding by utilizing a catalyst to generate excess reducing species in the gas before it reaches the bonding area. GlobalData’s report on Kulicke & Soffa Industries gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Kulicke & Soffa Industries, Under-screen biometric identification was a key innovation area identified from patents. Kulicke & Soffa Industries's grant share as of July 2024 was 48%. Grant share is based on the ratio of number of grants to total number of patents.
The patent US12062636B2 describes a bonding system designed for the efficient bonding of semiconductor elements to substrates. Central to this system is a bond head assembly that carries a bonding tool, along with a bond head manifold that receives a reducing gas from a source. This reducing gas is crucial for the bonding process and is delivered to the bonding area via a reducing gas conduit. Notably, the conduit is equipped with a catalyst that generates excess reducing species, such as H+ ions, prior to reaching the bonding area. The catalyst can be configured in various forms, including mesh, perforated blocks, or as a coating on the inner surface of the conduit, and is typically made from noble metals.
Additionally, the system includes features that enhance its functionality, such as a heating element within the reducing gas conduit and the capability to direct the reducing gas to a substrate oxide reduction chamber. This chamber prepares the substrate before the bonding process, ensuring optimal conditions for adhesion. The design of the reducing gas conduit allows for effective delivery of the reducing gas to both the bond head assembly and the substrate oxide reduction chamber, thereby improving the overall bonding efficiency and quality of semiconductor devices.
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