According to GlobalData’s company profile on Inventec, Data center cooling systems was a key innovation area identified from patents. Inventec's grant share as of February 2024 was 58%. Grant share is based on the ratio of number of grants to total number of patents.

Fixing device with double-layer chip for circuit board

A recently granted patent (Publication Number: US11924989B2) discloses a fixing device designed with innovative features to enhance thermal management in electronic devices. The device comprises a circuit board with openings, a first cover with a bump, a second cover with heat dissipation structures, and a reinforcing piece with fixing portions. A double-layer chip is electrically connected to the circuit board, with the upper layer in contact with the first cover and the lower layer in contact with the second cover, ensuring efficient heat dissipation.

The patent further details various configurations and enhancements to the fixing device, such as the reinforcing piece being fully attached to the first surface, the positioning of the first bump between fixing portions, and the embedding of the upper layer of the double-layer chip into the opening. Additionally, the use of thermal conductive material in the bumps ensures effective heat transfer. These features collectively contribute to improved thermal performance and stability in electronic devices, making the fixing device a valuable innovation in the field of electronic component assembly and heat management.

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