Intel had one patents in 3D printing during Q2 2024. Intel Corp filed a patent for a heat pipe with a variable dimension exoskeleton made of heat-conductive material using blow molding or additive manufacturing. The exoskeleton includes portions with different dimensions, allowing for more efficient heat transfer. The method of manufacturing involves forming the exoskeleton with varying dimensions using the same techniques. GlobalData’s report on Intel gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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Intel had no grants in 3D printing as a theme in Q2 2024.
Recent Patents
Application: Variable dimension heat pipe (Patent ID: US20240175640A1)
The patent filed by Intel Corp describes a heat pipe with a variable dimension exoskeleton made of a heat-conductive material using blow molding or additive manufacturing. The exoskeleton includes portions with different dimensions, allowing for flexibility in design and application. The method of manufacturing the heat pipe involves providing the heat-conductive material and forming the exoskeleton with varying dimensions through blow molding or additive manufacturing. The heat pipe can include a wick and is suitable for dissipating heat from a heat source in a heat transfer system.
The claims detail the specific features of the heat pipe, such as the materials it can be made from, the methods of manufacturing, the inclusion of a wick, and its application in a heat transfer system. The dimensions of the exoskeleton can vary in length, width, or thickness, with portions extending in different directions or being contiguous. The method of manufacturing involves sealing the ends of the exoskeleton, inserting a wick, adding a working fluid, and hermetically sealing the heat pipe. Overall, the patent outlines a versatile heat pipe design and manufacturing process suitable for efficient heat dissipation in electronic devices.
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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.
GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
