Ichor has been granted a patent for a semiconductor manufacturing method utilizing a fluid delivery system. This method features a three-layer arrangement with active components and substrate blocks, incorporating seal inserts to establish fluid connections, facilitating the delivery of liquid chemicals for processing semiconductor wafers. GlobalData’s report on Ichor gives a 360-degree view of the company including its patenting strategy. Buy the report here.
According to GlobalData’s company profile on Ichor, was a key innovation area identified from patents. Ichor's grant share as of July 2024 was 46%. Grant share is based on the ratio of number of grants to total number of patents.
Fluid delivery system for semiconductor manufacturing processes
The patent US12062553B2 outlines a method for manufacturing semiconductor devices that involves a sophisticated liquid chemical delivery system. This system is structured in a three-layer arrangement, consisting of a top layer of active components, a middle layer of substrate blocks that facilitate fluid connections, and a bottom layer serving as a support structure. Each substrate block features an upper surface with inlet and outlet ports, along with a fluid passageway connecting them. The active components include various devices such as flow controllers and pressure transducers, which are strategically aligned with the substrate blocks to create fluid connections. The design incorporates seal inserts that ensure fluid integrity, forming a flow pathway for delivering chemical liquids to process semiconductor wafers.
The claims further detail the materials used for the substrate blocks, which can include polymers like polypropylene and PTFE, and describe the construction of the seal inserts that enhance fluid sealing through tapered designs. The method also emphasizes the importance of a weldless and tubeless flow pathway, which contributes to the efficiency of the chemical delivery system. Additionally, the patent specifies that the fluid passageways may have unique geometries, such as arcs, to optimize fluid flow. Overall, this patent presents a comprehensive approach to improving the manufacturing process of semiconductor devices through innovative fluid delivery mechanisms.
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