Tech giant IBM and Japanese semiconductor manufacturer Rapidus have entered into a joint development agreement to advance mass production technologies for chiplet packages.
The tie up will focus on 2nm-generation semiconductors.
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It is part of the “Development of Chiplet and Package Design and Manufacturing Technology for 2nm-Generation Semiconductors” project by Japan’s New Energy and Industrial Technology Development Organization.
Under this agreement, Rapidus will utilise IBM’s packaging technology to innovate high-performance semiconductors.
The collaboration will take place at IBM’s North American facilities, where both companies’ engineers will focus on research and development (R&D), as well as the manufacturing of semiconductor packaging for high-performance computing systems.
IBM has experience in R&D and manufacturing technologies for semiconductor packaging, having previously engaged in joint development with Japanese semiconductor manufacturers.
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By GlobalDataThis expertise is expected to help Rapidus establish advanced chiplet packaging technology.
IBM SVP and director of research Darío Gil said: “With decades of innovation in advanced packaging, IBM is honored to expand our collaboration with Rapidus to develop state-of-the-art chiplet technology.
“Through our agreement, we are committed to supporting the development of the most advanced node production processes, design, and packaging, as well as developing new use cases and supporting the semiconductor workforce.”
Rapidus president and CEO Atsuyoshi Koike said: “Building on our current joint development agreement for 2nm semiconductor technology, we are extremely pleased to officially announce today this partnership with IBM to establish chiplet packaging technology.
“We will make the most of this international collaboration, and pursue initiatives that will allow Japan to play an even more important role in the semiconductor packaging supply chain.”
In April 2024, IBM announced its intention to acquire HashiCorp for $6.4bn to expand cloud software offerings.
HashiCorp, a US-based company, provides tools for businesses to build and manage cloud infrastructures.
