IBIDEN has filed a patent for a printed wiring board that includes multiple conductor layers and a via conductor connecting them. The board also features a seed layer and an electrolytic plating layer on the second conductor layer and via conductor, with varying thicknesses in different portions. GlobalData’s report on IBIDEN gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on IBIDEN, Diesel Particulate Filters (DPF) was a key innovation area identified from patents. IBIDEN's grant share as of September 2023 was 27%. Grant share is based on the ratio of number of grants to total number of patents.
Printed wiring board with layered conductor and electrolytic plating
A recently filed patent (Publication Number: US20230319986A1) describes a printed wiring board with specific features related to the seed layer and electrolytic plating layer. The printed wiring board includes a first conductor layer, a resin insulating layer on top of it, a second conductor layer on the surface of the resin insulating layer, and a via conductor connecting the first and second conductor layers through an opening in the resin insulating layer.
The second conductor layer and the via conductor both consist of a seed layer and an electrolytic plating layer. The seed layer has three portions: a first portion on the surface of the resin insulating layer, a second portion on the inner wall surface of the opening in the resin insulating layer, and a third portion on the exposed first conductor layer. The first portion of the seed layer is thicker than the second and third portions.
The patent also mentions that the seed layer can be formed by sputtering and can include a combination of a copper alloy and copper. The copper alloy in the seed layer has a copper content of 90% or more in weight percent.
Overall, this patent describes a printed wiring board with specific characteristics related to the seed layer and electrolytic plating layer. These features aim to improve the performance and reliability of the printed wiring board in electronic devices.
To know more about GlobalData’s detailed insights on IBIDEN, buy the report here.
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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.
GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
