Hamamatsu Photonics had 12 patents in future of work during Q1 2024. The laser processing method involves preparing a wafer with functional elements separated by streets, then using laser light to selectively remove the surface layer of the street in certain regions based on information to prevent fractures from reaching the street. GlobalData’s report on Hamamatsu Photonics gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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Hamamatsu Photonics grant share with future of work as a theme is 58% in Q1 2024. Grant share is based on the ratio of number of grants to total number of patents.
Recent Patents
Application: Laser processing device and laser processing method (Patent ID: US20240051067A1)
The patent filed by Hamamatsu Photonics KK describes a laser processing method and apparatus for wafer processing. The method involves irradiating a street on the wafer with laser light to selectively remove the surface layer in specific regions of the street while leaving it intact in others. This process is based on information that ensures fractures from modified regions do not reach the street in certain areas. The apparatus includes a support part, an irradiation part, and a control part that work together to achieve this selective surface layer removal on the wafer street.
The laser processing apparatus further includes features such as controlling the movement of laser light along the street, utilizing image data and height data of the street for precise control, and incorporating position information of fracture tips. The method involves steps like preparing the wafer, irradiating the street based on the information, acquiring street information using a test wafer, and forming modified regions on the wafer. Overall, the patent focuses on a sophisticated laser processing technique that allows for precise and controlled removal of the surface layer on the wafer street to prevent fractures from reaching certain regions, enhancing the efficiency and quality of wafer processing in the semiconductor industry.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
