Hamamatsu Photonics had four patents in advanced materials during Q1 2024. The method described in the patent involves manufacturing a mirror device with a structural body containing a support portion, movable portion, and coupling portion, along with a mirror layer. The process includes forming parts on a wafer, adding the mirror layer to the movable portion, heating the parts, and then cutting the wafer to separate the individual mirror device components. GlobalData’s report on Hamamatsu Photonics gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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Hamamatsu Photonics grant share with advanced materials as a theme is 75% in Q1 2024. Grant share is based on the ratio of number of grants to total number of patents.
Recent Patents
Application: Method for manufacturing mirror device (Patent ID: US20240002219A1)
The patent filed by Hamamatsu Photonics KK describes a method for manufacturing a mirror device that includes a structural body with a support portion, movable portion, and coupling portion, along with a mirror layer on the movable part. The method involves forming parts on a wafer, applying the mirror layer, heating the movable parts, and then cutting the wafer to separate the parts.
Additionally, the method may include measuring the warp of the mirror layer, cutting the wafer using laser light, reducing or increasing warp through heating, forming the mirror layer by sputtering, incorporating a driving force element like a coil or piezoelectric element, maintaining specific temperature ranges during heating, controlling the width of the mirror layer, and including various layers like an adhesive layer, diffusion prevention layer, and reflective layer. The heating process can involve heating the entire wafer or specific parts, with the option to use a thermostatic chamber for multiple wafers.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
