Fujitsu had five patents in advanced materials during Q4 2023. Fujitsu Ltd filed a patent for a substrate with a heat conduction member made of carbon nanotubes, resin layers, and metal layers. Another patent describes a quantum bit circuit with Majorana carriers that can exchange Majorana particles, enabling quantum computing capabilities. GlobalData’s report on Fujitsu gives a 360-degreee view of the company including its patenting strategy. Buy the report here.
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Fujitsu grant share with advanced materials as a theme is 0% in Q4 2023. Grant share is based on the ratio of number of grants to total number of patents.
Recent Patents
Application: Substrate (Patent ID: US20230382076A1)
The patent filed by Fujitsu Ltd. describes a substrate with a heat conduction member made of carbon nanotubes, resin layers, and metal layers. The resin layers do not contain fillers and fill the spaces between the carbon nanotubes. The metal layers are laminated on the resin layers, providing a structure that enhances heat conduction efficiency.
Additionally, the patent includes claims for substrates with multiple heat conduction members, ceramic substrates sandwiched between resin layers, and resin layers with varying thermal conductivities. The design allows for efficient heat dissipation and electrical connections through additional carbon nanotubes. The use of specific materials like polyphenylene ether-based resin and the arrangement of openings and pads further optimize the substrate's performance in various applications.
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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.
GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
