Taiwan Semiconductor Manufacturing had one patents in 3D printing during Q2 2024. The patent filed by Taiwan Semiconductor Manufacturing Co Ltd in Q2 2024 describes a package design for integrated circuit devices, with an encapsulant surrounding two devices, a heat dissipation structure, sealant, adhesive, and lid with cooling passages for efficient heat dissipation. GlobalData’s report on Taiwan Semiconductor Manufacturing gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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Taiwan Semiconductor Manufacturing had no grants in 3D printing as a theme in Q2 2024.
Recent Patents
Application: Package with heat dissipation structure and method for forming the same (Patent ID: US20240145342A1)
The patent filed by Taiwan Semiconductor Manufacturing Co Ltd describes a package design for integrated circuit devices that includes a lid with cooling passages aligned to heat dissipation structures and integrated circuit devices. The package also features a sealant and adhesive for secure attachment and thermal management. The lid design allows for efficient cooling of both the heat dissipation structure and the integrated circuit devices, enhancing overall performance and reliability.
Additionally, the package design includes features such as elastic rings, cavities with channels, and specific arrangements of cooling passages to optimize thermal management and ensure effective heat dissipation. The method for forming the package involves precise steps such as filling channels with sacrificial material, drilling cooling passages in the lid, and utilizing molding or 3D printing techniques for lid fabrication. Overall, the package design and manufacturing method outlined in the patent aim to improve the thermal performance and reliability of integrated circuit devices in a compact and efficient manner.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
