Powertech Technology. has been granted a patent for a novel package structure that integrates two dies, an encapsulant, and various conductive and insulating layers. This design features a sensing area, a light-transmitting sheet, and a unique through-silicon via for electrical connections, enhancing functionality in semiconductor applications. GlobalData’s report on Powertech Technology gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Powertech Technology, Under-screen biometric identification was a key innovation area identified from patents. Powertech Technology's grant share as of June 2024 was 58%. Grant share is based on the ratio of number of grants to total number of patents.
Integrated package structure for semiconductor dies with sensing capabilities
The patent US11990494B2 describes a novel package structure that integrates multiple components to enhance functionality and performance. The structure includes a first die with a silicon substrate and a die pad, featuring an active surface with a sensing area. A second die is positioned such that its back surface faces the back surface of the first die. The assembly is encapsulated, with a dam structure that exposes the sensing area, and a light-transmitting sheet placed on top. The design incorporates conductive connectors and circuit layers that facilitate electrical connections between the dies, utilizing through silicon vias for efficient signal transmission. Additionally, an insulating layer penetrates the silicon substrate, ensuring electrical isolation while maintaining connectivity to the die pad.
Further claims detail enhancements to the package structure, such as the inclusion of a die connector on the second die that is coplanar with the encapsulating surface. The second circuit layer can be positioned between the first and second dies, optimizing space and functionality. The design also creates an enclosed space formed by the first die, dam structure, and light-transmitting sheet, with specific air pressure conditions maintained within this space and a gas gap. This innovative approach aims to improve the overall performance of the package structure, potentially benefiting applications that require precise sensing and efficient electrical connections.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
