Fujitsu had five patents in advanced materials during Q1 2024. Fujitsu Ltd filed a patent for a method of manufacturing a conductive heat radiation film using a first heated film with metal particles and carbon nanotubes adhered to it for stabilizing the shape. GlobalData’s report on Fujitsu gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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Fujitsu grant share with advanced materials as a theme is 40% in Q1 2024. Grant share is based on the ratio of number of grants to total number of patents.
Recent Patents
Application: Conductive heat radiation film, method of manufacturing the same, and method of manufacturing electronic device (Patent ID: US20240047299A1)
The patent filed by Fujitsu Ltd. describes a method for manufacturing a conductive heat radiation film that includes growing carbon nanotubes over a substrate, applying a paste with metal particles to the tips of the nanotubes, forming a heated film by heating the paste, and then peeling the nanotubes from the substrate. The metal particles can be silver or copper, with specific temperature requirements during the manufacturing process.
Furthermore, the method extends to manufacturing an electronic device by sintering the heated film to a component, connecting the nanotubes to another component, and forming a sintered film. The process involves specific temperature conditions for sintering, different metal particles, and the creation of coating films to enhance the connection between components. The resulting electronic device benefits from the conductive heat radiation film's flexibility and density, providing improved thermal management capabilities.
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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.
GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
