Corning had three patents in internet of things during Q4 2023. The patent filed by Corning Inc in Q4 2023 discloses a sensor with a ceramic substrate, a thin piezoelectric layer, and electrical contacts. The sensor is designed for use in wearable devices and the patent also includes a method for manufacturing the sensor. GlobalData’s report on Corning gives a 360-degreee view of the company including its patenting strategy. Buy the report here.
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Corning grant share with internet of things as a theme is 66% in Q4 2023. Grant share is based on the ratio of number of grants to total number of patents.
Recent Patents
Application: Flexible-piezoelectric sensors made with thin ribbon ceramics and transition metal dichalcogenides (Patent ID: US20230337543A1)
The patent filed by Corning Inc. describes a sensor comprising a ceramic substrate with a thickness ranging from 10 µm to 200 µm, a piezoelectric layer with a thickness of 10 µm or less, and at least one electrical contact. The piezoelectric layer can be made of transition metal dichalcogenide (TMD) materials such as MoS2 or WS2, and the ceramic substrate can be made of materials like silica, zirconia, or alumina. The sensor can be used in wearable devices and is manufactured by sputtering the piezoelectric layer onto the ceramic substrate and heat treating it at a specific temperature range.
The sensor's design allows for flexibility and durability, making it suitable for wearable devices. The use of TMD materials in the piezoelectric layer enhances the sensor's performance, and the method of manufacturing involves precise steps like sputtering and heat treatment to ensure quality. The sensor's compatibility with different ceramic materials and the option to laminate it with polymer layers further enhance its versatility and potential applications in various industries.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
