Corning had six patents in connectivity during Q1 2024. Corning Inc’s patent filed in Q1 2024 describes an optoelectronic assembly that includes a photonic integrated circuit (PIC) with electronic connection elements and waveguides, a printed circuit board (PCB) with complementary electronic connection elements for flip chip mounting the PIC, a lidless fiber array unit with optical fibers supported on a substrate, and an alignment substrate for aligning the fibers with the waveguides. GlobalData’s report on Corning gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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Corning grant share with connectivity as a theme is 33% in Q1 2024. Grant share is based on the ratio of number of grants to total number of patents.
Recent Patents
Application: High-density faus and optical interconnection devices and related methods (Patent ID: US20240036284A1)
The patent filed by Corning Inc. describes an optoelectronic assembly that includes a photonic integrated circuit (PIC) with electronic connection elements and waveguides, a printed circuit board (PCB) with complementary electronic connection elements for flip chip mounting the PIC, and a lidless fiber array unit with optical fibers aligned with the waveguides using an alignment substrate. The assembly also features a cap to retain the fiber array unit in contact with the waveguides, with variations in the cap design to enhance retention and alignment.
The claims detail specific aspects of the optoelectronic assembly, such as the configuration of the cap with protrusions or depressions on the support substrate, the bonding of the cap to the PIC, and the engagement between the depression and protrusion to resist removal of the fiber array unit. These claims highlight the innovative design elements aimed at improving the performance and reliability of the optoelectronic assembly, particularly in terms of securing the fiber array unit in alignment with the waveguides on the PIC. Overall, the patent focuses on the integration of various components to create a robust and efficient optoelectronic system for optical communication applications.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
