Atos has been granted a patent for a method to manufacture a heat sink for supercomputer liquid cooling systems. The process involves friction-stir welding a base plate to a machined central rib and rim, ensuring efficient heat dissipation from electronic components. GlobalData’s report on Atos gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Atos, Access control systems was a key innovation area identified from patents. Atos's grant share as of June 2024 was 68%. Grant share is based on the ratio of number of grants to total number of patents.
Heat sink manufacturing method for supercomputer liquid cooling
The patent US12042890B2 outlines a method for manufacturing a heat sink specifically designed for the liquid cooling systems of compute blades in supercomputers. The heat sink consists of a body with a heat collection face, a fluidic connection member, and a heat dissipation fin module. The body features a central through-opening that connects the heat collection face to the fluidic connection face. The fluidic connection member includes a parallelepiped-shaped central part with a fastening element and two conduits for cooling liquid circulation. The method involves positioning the fastening element within the central opening, machining the heat collection face to create cavities for the fin assemblies, and friction-stir welding the base plate of the fin module to the machined components.
Further claims detail specific aspects of the manufacturing process, such as the extent of welding on the central rib and support rim, with options for welding over more than half or three-quarters of the rib's length. The method also allows for the pre-manufacturing of the body, fluidic connection member, and fin module, which can be made from the same material, preferably aluminum, specifically series 6063 aluminum. The design includes a central rib with a flat contact surface for the base plate, and the rib's width is specified to be between 3.9 and 6 mm. This patent presents a comprehensive approach to enhancing the efficiency of heat dissipation in high-performance computing environments.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
