Corning had two patents in advanced materials during Q4 2023. Corning Inc has developed a thin ceramic substrate sensor with a piezoelectric layer for wearable devices. The sensor has a thickness ranging from 10 µm to 200 µm, with the piezoelectric layer being 10 µm or less. The sensor also includes electrical contacts for improved functionality. GlobalData’s report on Corning gives a 360-degreee view of the company including its patenting strategy. Buy the report here.
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Corning grant share with advanced materials as a theme is 50% in Q4 2023. Grant share is based on the ratio of number of grants to total number of patents.
Recent Patents
Application: Flexible-piezoelectric sensors made with thin ribbon ceramics and transition metal dichalcogenides (Patent ID: US20230337543A1)
The patent filed by Corning Inc. describes a sensor comprising a ceramic substrate with a thickness ranging from 10 µm to 200 µm, a piezoelectric layer with a thickness of 10 µm or less, and at least one electrical contact. The piezoelectric layer can be made of transition metal dichalcogenide (TMD) materials such as MoS2 or WS2, and the ceramic substrate can be made of materials like silica, zirconia, or alumina. The sensor can be used in wearable devices and is manufactured by sputtering the piezoelectric layer onto the ceramic substrate and heat treating it at a specific temperature range.
The sensor's design allows for a thin and efficient structure suitable for wearable devices, with the piezoelectric layer providing high sensitivity and the ceramic substrate offering durability. The method of manufacturing involves precise steps like sputtering the TMD material onto the substrate and heat treating it to optimize performance. The use of specific materials and processes ensures the sensor's reliability and functionality, making it a promising technology for various applications in the field of wearable devices.
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