Cohu has been granted a patent for a test module that can be used to test microphones in the semiconductor industry. The module consists of an airtight outer chamber and a sound chamber with an electrical test device. The sound chamber is connected to the outer chamber with a structure that suppresses noise. The space between the chambers has lower gas pressure than the ambient air pressure. The module allows for testing of microphones by evacuating the space between the chambers and applying test signals. GlobalData’s report on Cohu gives a 360-degree view of the company including its patenting strategy. Buy the report here.
According to GlobalData’s company profile on Cohu, it's grant share as of June 2023 was 1%. Grant share is based on the ratio of number of grants to total number of patents.
Microphone test module with airtight chambers and noise suppression
A recently granted patent (Publication Number: US11671776B2) describes a microphone test module designed for testing microphones in the field of semiconductor testing. The module consists of an outer chamber and a sound chamber, with the sound chamber housing an electrical test device for testing the microphone. The electrical test device includes a test socket for semiconductor testing, which applies test signals to the microphone and transmits data and test signals to a tester located outside the outer chamber. The sound chamber is connected to the outer chamber using a connection that suppresses structure-borne noise, with a lower gas pressure in the space between the chambers compared to the ambient air pressure.
The sound chamber is divided into two halves, providing an opening to receive the microphone to be tested and an electrical connection to the test device. A mating actuator is mounted between the two halves, allowing for a mating movement to form an airtight sound chamber when closed. The outer chamber features an opening and a door that can be opened to receive the microphone during testing and closed to create an airtight seal.
The patent also describes additional features of the microphone test module, including the use of elastic suspensions or supports to further suppress structure-borne noise. A vacuum pump is included to evacuate the space within the outer chamber, either by directly connecting to the chamber or indirectly through a vacuum reservoir connected via a closed valve. The module also includes a supply cable for electrical power and data transfer, which goes through the outer chamber and connects to the microphone during testing.
The patent further discloses an automated test system that incorporates the microphone test module, along with a handler and a carrier for carrying the microphones. Additionally, a method of semiconductor testing microphones is described, which involves providing an airtight outer chamber and sound chamber, evacuating the space between the chambers, and testing the microphone using the electrical test device.
Overall, this patent presents a microphone test module and associated methods that aim to provide an effective and reliable solution for testing microphones in the field of semiconductor testing. The module's design includes features to suppress noise and ensure accurate testing, while the automated test system offers a streamlined and efficient testing process.
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