Cohu has filed a patent for a high-speed circuit assembly that includes a waveguide/transmission line and a radiation absorbing material in contact with or close to the waveguide/transmission line. The radiation absorbing material is designed to modify the radio frequency signal carried by the waveguide/transmission line. GlobalData’s report on Cohu gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile, Cohu's grant share as of September 2023 was 61%. Grant share is based on the ratio of number of grants to total number of patents.
High-speed circuit assembly with radiation absorbing material
A recently filed patent (Publication Number: US20230243869A1) describes a circuit assembly that includes a waveguide or transmission line to carry a radio frequency signal. The circuit assembly also includes a radiation absorbing material that is in contact with or in close proximity to the waveguide/transmission line. The purpose of the radiation absorbing material is to modify or attenuate the radio frequency signal.
The patent claims that the radiation absorbing material can also terminate the radio frequency signal or form a choke to extract a direct current signal if the radio frequency signal includes both high-frequency and direct current components. The circuit assembly can be implemented using a lead frame or a PCB trace. In the case of a lead frame, a frame assembly may be included to provide a ground reference or a power supply.
The radiation absorbing material can be disposed in contact with and adjacent to the frame assembly, or it can be partially within a recess in the frame assembly. The circuit assembly may also include at least one ring coupler. The radiation absorbing material is designed to absorb signals in the centimeter-wave, millimeter-wave, and sub-millimeter wave bands, with specific functioning frequencies ranging from about 0.4 GHz to about 81 GHz.
In addition to describing the circuit assembly, the patent also includes a method for using it. The method involves applying a high-frequency signal to the circuit assembly and attenuating or choking the signal using the radiation absorbing material.
Overall, this patent describes a circuit assembly that incorporates a radiation absorbing material to modify, attenuate, or terminate radio frequency signals. The assembly can be implemented using a lead frame or a PCB trace and can be used in various applications that require signal manipulation in the specified frequency ranges. The method described in the patent provides a practical approach for utilizing the circuit assembly in high-frequency signal applications.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
