Cisco Systems. has been granted a patent for a device featuring solder reflow compatible connections between optical components. The invention utilizes reflow compatible epoxies that maintain bonding at high temperatures, with a defined light path across an air gap between the components, enhancing optical performance. GlobalData’s report on Cisco Systems gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Cisco Systems, Satellite internet access was a key innovation area identified from patents. Cisco Systems's grant share as of June 2024 was 71%. Grant share is based on the ratio of number of grants to total number of patents.
Solder reflow connections for optical components using epoxies
The granted patent US12044884B2 describes a device that integrates two optical components, each featuring distinct optical channels positioned at different heights relative to a reference plane. The device includes a first optical component with a first optical channel and a second optical component with a second optical channel, which are aligned to create a light path that traverses an air gap between them. This air gap is characterized by sloped interface surfaces, and the components are bonded together using a solder bond. Additionally, the patent outlines the use of a reflow-compatible epoxy that maintains its bond and refractive index compatibility at high temperatures, ensuring the integrity of the optical connection.
Further claims detail the structural and functional aspects of the device, including the potential for a shared platform that connects the optical components to an electrical integrated circuit. The optical channels can consist of an optical fiber and a photonic waveguide, and the design allows for the inclusion of spacers to maintain the vertical reference between the components. The method for assembling the device involves positioning the optical components to define the air gap, securing them with a solder bond, and applying the epoxy to enhance stability and performance. The patent emphasizes the importance of maintaining alignment and structural integrity in high-temperature environments, which is critical for applications in photonic integrated circuits.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
