BE Semiconductor Industries has been granted a patent for a die bonder featuring a bonding head that includes a shaft, housing, and a single electric motor. The design allows for rotational movement and controlled axial displacement, utilizing a pneumatic force generator and an encoder for precise positioning. GlobalData’s report on BE Semiconductor Industries gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on BE Semiconductor Industries, was a key innovation area identified from patents. BE Semiconductor Industries's grant share as of June 2024 was 62%. Grant share is based on the ratio of number of grants to total number of patents.
Die bonder with a rotationally driven bonding head
The patent US12046490B2 describes a die bonder designed for mounting components onto substrates, featuring a bonding head that operates along a longitudinal axis. The bonding head includes a shaft that allows for both rotational and axial movement, facilitated by a housing part with a bearing. A single electric motor drive is integrated to provide rotational motion to the shaft, which is coaxial with the drive. The system incorporates an encoder to measure the shaft's rotational position and a pneumatic force generator that applies force along the longitudinal axis using a single pressure chamber. Notably, the rotor of the motor contains permanent magnets arranged in a specific configuration to ensure consistent magnetic interaction with the stator coils, thereby maintaining force stability during the shaft's axial displacement.
Additional features of the die bonder include an air bearing for smooth operation, with strategically placed air inlets and outlets for compressed air management. The encoder system is designed with a circular disc and an encoder reading head that ensures accurate measurement throughout the shaft's stroke. Furthermore, the die bonder is equipped with a temperature control device aimed at maintaining specific temperature conditions for critical components of the bonding head. This innovative design aims to enhance the precision and efficiency of the die bonding process, addressing key operational challenges in the field.
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