AUO has been granted a patent for a panel device with a unique design involving a substrate, conductor pad, turning wire, and circuit board. The device allows for efficient electrical connections and manufacturing processes. GlobalData’s report on AUO gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on AUO, Under-screen fingerprint recognition was a key innovation area identified from patents. AUO's grant share as of April 2024 was 81%. Grant share is based on the ratio of number of grants to total number of patents.
Panel device with turning wire connecting substrate and circuit board
The granted patent (Publication Number: US11963300B2) discloses a panel device comprising a substrate with two surfaces, a conductor pad on the first surface, and a turning wire extending from the first surface to the second surface. The turning wire includes a wiring layer in contact with the conductor pad and a wire covering layer. A circuit board is bonded to the wire covering layer, with the wire covering layer projecting more on the first surface than the wiring layer.
Additionally, the panel device includes features such as the outline of the wiring layer being recessed relative to the wire covering layer, different conductivities for the wiring layer and wire covering layer, and various options for the wire covering layer material. The device may also have a conductive bonding layer for bonding the circuit board to the wire covering layer and a heterogeneous contact interface between the conductive pad and the wiring layer. Furthermore, the substrate may have a third surface connected to the second surface, with the turning wire extending to the third surface, providing a comprehensive and innovative solution for panel devices in various applications.
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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.
GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
