Amkor Technology has been granted a patent for a method of forming packaged electronic devices. The method involves attaching semiconductor devices to a substrate in different orientations and providing a second substrate with conductive connectors. The connectors are attached to the semiconductor devices to create a subassembly, which is then encapsulated in a package body. The subassembly can be separated to provide the packaged electronic devices. GlobalData’s report on Amkor Technology gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Amkor Technology, Under-screen biometric identification was a key innovation area identified from patents. Amkor Technology's grant share as of September 2023 was 58%. Grant share is based on the ratio of number of grants to total number of patents.
Packaged electronic device with conductive clip and exposed surfaces
A recently granted patent (Publication Number: US11764135B2) describes a packaged electronic device that includes a pad, an electronic device, and a conductive clip. The pad has a top side and a bottom side, and the electronic device is coupled to the top side of the pad. The conductive clip consists of a plate portion, a conductive member extending from one side of the plate portion, a connective portion extending from the conductive member, and a conductive linking portion extending from the other side of the plate portion. The plate portion is connected to the electronic device. The packaged electronic device is encapsulated by a package body, with the bottom surface of the connective portion exposed outside of the package body's major surface. The distal end surface of the connective portion is exposed outside of one side surface of the package body, and the distal end surface of the conductive linking portion is exposed outside of a different side surface of the package body.
In addition to the above, the patent also describes a plated conductive material that is disposed over the bottom surface of the connective portion. The second side surface of the package body is adjacent to the first side surface. The conductive clip may also include a second conductive linking portion extending from a different side segment of the plate portion, with its distal end surface exposed outside of a side surface of the package body that is different from the first side surface.
The patent further discloses a packaged electronic device that includes a pad, an electronic device, a conductive clip, and a package body. The conductive clip consists of a plate portion, a conductive member, a connective portion, a first conductive linking portion, and a second conductive linking portion. The plate portion is connected to the electronic device. The package body encapsulates the electronic device and portions of the conductive clip. The distal end surfaces of the connective portion, the first conductive linking portion, and the second conductive linking portion are exposed outside of different side surfaces of the package body. A plated conductive material is disposed adjacent to the bottom surface of the connective portion. The distal end surfaces of the first and second conductive linking portions are devoid of the plated conductive material. The distal end surface of the first conductive linking portion is coplanar with the second side surface of the package body, while the distal end surface of the second conductive linking portion is coplanar with another side surface of the package body.
Overall, this patent describes a packaged electronic device with specific features related to the conductive clip and package body, providing potential improvements in the design and functionality of electronic devices.
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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.
GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
