Cisco Systems. has been granted a patent for an apparatus featuring a printed circuit board, an integrated circuit, and a heat sink. The heat sink utilizes a bimetallic material that adjusts airflow and maintains contact with the IC component when temperatures exceed a specified threshold. GlobalData’s report on Cisco Systems gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Cisco Systems, Satellite internet access was a key innovation area identified from patents. Cisco Systems's grant share as of July 2024 was 71%. Grant share is based on the ratio of number of grants to total number of patents.
Heat sink with bimetallic material for cooling ic
The patent US12074081B2 describes an innovative apparatus designed to enhance thermal management in electronic devices. Central to this apparatus is a printed circuit board (PCB) that supports an integrated circuit (IC) component, which is coupled with a heat sink. The heat sink features a base plate positioned directly over the IC, a series of cooling fins extending from the base plate, and a diverter that directs airflow towards the cooling fins. A key aspect of the design is the incorporation of a bimetallic material within the heat sink, which reacts to temperature changes. When the temperature exceeds a specified threshold, the bimetallic material bends, thereby increasing airflow to the cooling fins or maintaining contact between the IC and the base plate, thus improving heat dissipation.
Further claims detail the composition and functionality of the bimetallic material, which consists of two different metals with varying coefficients of thermal expansion. This material can be integrated into various components of the heat sink, including the diverters and cooling fins, allowing for dynamic adjustments in airflow based on temperature. The design also includes features such as a top plate that bends to create an air gap when heated, enhancing cooling efficiency. The patent outlines multiple configurations of the heat sink, emphasizing the versatility of the bimetallic material in optimizing thermal performance across different components. Overall, this patent presents a comprehensive approach to managing heat in electronic systems, potentially leading to improved reliability and performance of electronic devices.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
