ASML Holding has been granted a patent for a fluid handling system designed to wet a substrate during radiation exposure. The system features two devices that supply distinct liquids to separate spaces on the substrate, allowing simultaneous application without removing liquid from the second space, creating a liquid layer. GlobalData’s report on ASML Holding gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on ASML Holding, AI-assisted photolithography was a key innovation area identified from patents. ASML Holding's grant share as of July 2024 was 56%. Grant share is based on the ratio of number of grants to total number of patents.
Fluid handling system for simultaneous liquid application on substrate
The granted patent US12072636B2 describes a fluid handling system designed for wetting a specific region of a substrate's surface that is being irradiated by a radiation beam. The system includes a first device that confines a first liquid in a space between itself and the substrate, featuring an aperture for the radiation beam to pass through. This first device is equipped with liquid supply and extraction members to manage the first liquid. Additionally, a second device is included, which supplies a second liquid to a separate space on the substrate's surface, creating a gap between the two liquids. The system allows for the simultaneous application of both liquids without removing any liquid from the second space, thereby forming a liquid layer over the irradiated region.
Further claims detail the configuration of the fluid handling system, including the use of spray nozzles for the second liquid supply and various arrangements of extraction and gas supply members on the first device. The design may incorporate porous materials in the extraction members to facilitate liquid recovery. The patent also outlines the potential for a third device to manage a third liquid, enhancing the system's versatility. The fluid handling system is intended for use in lithographic applications, where precise control over liquid application is critical for effective substrate processing. The integration of these components aims to improve the efficiency and effectiveness of fluid management in conjunction with radiation exposure.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
