IBM has been granted a patent for a rack housing system that includes movable supports for electronic devices, allowing for adjustable air volume to optimize cooling in data centers. The method involves repositioning devices vertically to enhance airflow from a raised floor, improving cooling efficiency. GlobalData’s report on International Business Machines gives a 360-degree view of the company including its patenting strategy. Buy the report here.
According to GlobalData’s company profile on International Business Machines, M2M communication interfaces was a key innovation area identified from patents. International Business Machines's grant share as of June 2024 was 73%. Grant share is based on the ratio of number of grants to total number of patents.
Adjustable rack housing for cooling electronic devices
The patent US12048125B2 outlines a method for optimizing the cooling efficiency of electronic devices housed in a rack within a data center. The method involves the repositioning of multiple electronic devices within a rack housing, which defines an adjustable air volume that is in fluid communication with cooling air from a raised floor. This repositioning can be achieved by vertically moving the devices as a group or individually, depending on the specific cooling needs of the data center. The method emphasizes the use of actuators to facilitate this movement, allowing for adjustments based on various data inputs, including the cooling requirements of the data center and the air volume and pressure within the rack housing.
Additionally, the claims detail that the repositioning can be influenced by data from other rack housings within the data center, enabling a coordinated approach to managing cooling across multiple units. The method allows for the creation of different adjusted air volumes in various rack housings, ensuring that each unit can be optimized for its specific cooling needs. This adaptability is crucial for maintaining efficient operation in data centers, where thermal management is essential for the performance and longevity of electronic equipment. Overall, the patent presents a systematic approach to enhancing cooling efficiency through dynamic repositioning of electronic devices based on real-time data analysis.
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