Advanced Micro-Fabrication Equipment. has been granted a patent for a multi-zone heating apparatus designed for plasma processing. This technology features independently controlled foil heaters and switches, reducing the need for external wiring and filters, and is integrated between the electrostatic chuck and base of the apparatus. GlobalData’s report on Advanced Micro-Fabrication Equipment gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Advanced Micro-Fabrication Equipment, 3D memory devices was a key innovation area identified from patents. Advanced Micro-Fabrication Equipment's grant share as of June 2024 was 53%. Grant share is based on the ratio of number of grants to total number of patents.
Multi-zone heating apparatus for plasma processing equipment
The granted patent US12046458B2 describes a bottom electrode assembly designed for plasma processing apparatuses, featuring a multi-zone heating apparatus that enhances temperature control for wafers held by an electrostatic chuck. The assembly includes a base, an electrostatic chuck, and a multi-zone heating apparatus positioned between them. This heating apparatus consists of multiple switches connected to foil heaters, forming heating units that can be independently controlled. Each switch is linked to a driving wire that transmits a driving signal, allowing for precise control over the operating time of the foil heaters. The design also incorporates a driver that communicates with the switches, enabling multi-zone temperature adjustments based on specific control signals.
Additionally, the patent outlines various configurations and components of the plasma processing apparatus, including the arrangement of heating units, the presence of a coolant channel, and the integration of a control bus for temperature adjustments. The system is designed to operate with a current of 100 milliamperes or less, ensuring safety and efficiency. The apparatus can include multiple drivers and a modulation circuit to further refine the control of heating signals. The overall structure allows for a sophisticated interconnect layer that facilitates the connection between the heating units and switches, enhancing the operational capabilities of the plasma processing system.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
