Inventec has been granted a patent for a fan assembly that includes a mounting bracket, a fan, and a circuit board assembly with gold fingers. The assembly features fasteners and a light-emitting component, enhancing its functionality and connectivity. GlobalData’s report on Inventec gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Inventec, Data center cooling systems was a key innovation area identified from patents. Inventec's grant share as of June 2024 was 55%. Grant share is based on the ratio of number of grants to total number of patents.
Fan assembly with circuit board and light emitting component
The granted patent US12048124B2 describes a fan assembly designed for integration into server systems. The assembly includes a mounting bracket, a fan, and a circuit board assembly featuring a circuit board with multiple gold fingers for electrical connectivity. The fan is secured within the mounting bracket using fasteners, and it incorporates a light-emitting component that is also electrically connected to the circuit board. Notably, the fan can be a dual-rotor type, and the circuit board's thickness is specified to be less than 1.6 millimeters, enhancing its compact design.
In addition to the fan assembly, the patent outlines a server configuration that includes a chassis and a motherboard assembly. The fan assembly is integrated into the chassis, with the circuit board assembly connected to a control circuit board that interfaces with the motherboard. The design allows for efficient airflow management while maintaining a streamlined structure, as the fan assembly is positioned on the rear side of the chassis, exposed to the outside. The configuration ensures that the circuit board of the fan assembly and the control circuit board are parallel to the chassis's bottom plate, optimizing space and functionality within the server environment.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
