Konica Minolta had four patents in advanced materials during Q2 2024. The patent filed by Konica Minolta Inc in Q2 2024 is for an ultrasonic probe that includes a piezoelectric element and a backing material with high thermal conductivity. The backing material is designed to have a ratio of thermal conductivity in the thickness direction to the horizontal direction of 3 or more. GlobalData’s report on Konica Minolta gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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Konica Minolta had no grants in advanced materials as a theme in Q2 2024.
Recent Patents
Application: Ultrasonic probe, ultrasonic diagnostic apparatus, and method for manufacturing backing material (Patent ID: US20240130711A1)
The patent filed by Konica Minolta Inc. describes an ultrasonic probe with a backing material that includes a matrix resin and thermally conductive particles, where the ratio of thermal conductivity in the thickness direction to the horizontal direction is 3 or more. The backing material is designed to enhance the performance of the ultrasonic probe by efficiently conducting heat in a specific direction.
The method for manufacturing the backing material involves mixing a raw material of matrix resin, thermally conductive particles, and non-thermally conductive particles to prepare a mixture, which is then molded under pressure and heat. The thermally conductive particles are oriented in the thickness direction of the backing material, with a specific particle size range and composition. Additionally, the ratio of sound velocity in the thickness direction to the horizontal direction is also considered in the manufacturing process to optimize the performance of the ultrasonic probe.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
