BE Semiconductor Industries has been granted a patent for a sawing device that forms saw-cuts in semiconductor products. The device includes sensors to determine positions of the product and saw blade, with a control unit for precise cutting. The invention aims to improve accuracy and efficiency in semiconductor manufacturing processes. GlobalData’s report on BE Semiconductor Industries gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on BE Semiconductor Industries, was a key innovation area identified from patents. BE Semiconductor Industries's grant share as of April 2024 was 62%. Grant share is based on the ratio of number of grants to total number of patents.
Sawing device for semiconductor product with precise position control
A recently granted patent (Publication Number: US11935764B2) discloses a sawing device designed for forming saw-cuts in semiconductor products. The device includes a carrier with a holding surface for the product, a saw blade with a cutting edge, and position sensors to determine the positions of the product's surface and the blade's edge. A control unit processes this data to control the movement of the blade relative to the carrier. The device features a reference system, such as reference surfaces on the carrier, to link the positions detected by the sensors and ensure precise cutting based on the relative positions of the product's surface and the blade's edge.
Furthermore, the patent includes a method for using the sawing device to form saw-cuts in semiconductor products. The method involves gripping the product with the carrier, determining the positions of the product's surface and the blade's edge using position sensors, and utilizing a reference system to link these positions for accurate cutting. The method also includes compensating for variations in the product's surface height during cutting and using feed-forward information from previous cuts to control the blade's movement for consecutive cuts. Additionally, the method involves conducting control measurements on the sawn product to register the positions of the saw-cuts, including parameters like saw-cut depth and offset. Overall, the patented sawing device and method aim to enhance the precision and efficiency of forming saw-cuts in semiconductor products through advanced position sensing and control mechanisms.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
