KLA had 30 patents in future of work during Q1 2024. KLA Corp’s patents filed in Q1 2024 focus on systems and methods for wafer shape metrology and determining information for specimens. The system includes a wafer shape metrology sub-system that measures distortion patterns on post-bonding pairs of wafers, with a controller applying a bonder control model to determine overlay distortion signatures. The methods involve generating sampling plans for out-of-specification detection in metrology processes, particularly suited for overlay metrology with sparse sampling plans. GlobalData’s report on KLA gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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KLA grant share with future of work as a theme is 33% in Q1 2024. Grant share is based on the ratio of number of grants to total number of patents.
Recent Patents
Application: System and method for mitigating overlay distortion patterns caused by a wafer bonding tool (Patent ID: US20240053721A1)
The patent filed by KLA Corp describes a system that includes a wafer shape metrology sub-system and a controller to perform shape measurements on post-bonding pairs of wafers. The controller applies a bonder control model to measured distortion patterns to determine overlay distortion signatures and provides feedback adjustments to the bonder tool if the distortion signatures are outside tolerance limits. The bonder control model consists of orthogonal wafer signatures representing achievable adjustments, and adjustments are made to bonder tool adjustors to minimize predicted overlay distortion.
The system and method outlined in the patent involve generating a bonder control model based on actuator-induced changes, receiving measured bonding distortions, applying the model to the distortions, and providing feedback adjustments to the bonder tool when necessary. The process includes bonding wafer pairs with different adjustor settings, measuring overlay distortion patterns, extracting actuator-induced changes, and generating orthogonal wafer signatures. Feedback adjustments are provided to minimize overlay distortion, and the adjustors can be controlled manually or via a computer system. The method also involves generating an adjustor control group and using principal component analysis to map orthogonal wafer signatures to bonder tool adjustors, ensuring efficient adjustment based on measured distortion patterns.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
